BG tape, Special for high bump process
Bump height>200um
Normal bump height applicable
MMC (Metal Matrix Composites) is a composite material which realized better properties by combining base metal and ceramics reinforcement material. It is a material that can respond to various customers' demands such as raise the rigidity without changing shape and weight, reduce weight while maintaining rigidity.
*Dual-Side Wafer Processing
→ Front or back-side wafer processing
*Small footprint
*No cross contamination
*Less chemical consumption
*State of the art technology
*Adaptable configuration
*Integrated chemical system
*Small footprint by standardized Design
& size
*Equipment manufacturing system through
3D design (Unit & Piping)
*Low Price
*Software / Hardware Reliability
*Diverse experience on FAB Turn-Key
project (Over Sea, Domestic)
*Patent on Wafer Transfer Robot
▪ Fully automated wafer handling
→ recipe-driven system (GUI)
▪ Customized recipe management
→ Sort, spilt, gather function etc.
▪ Small foot print
▪ Stand alone or Inline system
▪ Dual arm robot for Maximum throughput
▪ Compatible with FOUP, FOSB and various cassette type (200mm)
▪ Configurable load por
Founded in 2003, MACSEM Dynamics was a leading high-technology company dedicated to R&D, manufacturing and sales of advanced robots and semiconductor manufacturing equipment and materials. MACSEM is committed to providing world-class robots and high-end equipment and creating sustainable value for the society.
